Technical Program

IVMSP-L5: Stereoscopic and 3-D Processing

Session Type: Lecture
Time: Wednesday, April 22, 15:30 - 17:30
Location: Room 101A+B, TICC
Session Chair: Dan Schonfeld, University of Illinois at Chicago
 
IVMSP-L5.1: REAL-TIME STEREO MATCHING: A CROSS-BASED LOCAL APPROACH
         Jiangbo Lu; Katholieke Universiteit Leuven and IMEC
         Ke Zhang; Katholieke Universiteit Leuven and IMEC
         Gauthier Lafruit; IMEC
         Francky Catthoor; Katholieke Universiteit Leuven and IMEC
 
IVMSP-L5.2: COMBINED IMAGE PLUS DEPTH SEAM CARVING FOR MULTIVIEW 3D IMAGES
         Vikas Ramachandra; University of California, San Diego
         Matthias Zwicker; University of California, San Diego
         Truong Nguyen; University of California, San Diego
 
IVMSP-L5.3: A VARIATIONAL FRAMEWORK FOR SIMULTANEOUS MOTION AND DISPARITY ESTIMATION IN A SEQUENCE OF STEREO IMAGES
         Wided Miled; TELECOM ParisTech
         Béatrice Pesquet-Popescu; TELECOM ParisTech
         Wael Chérif; TELECOM ParisTech
 
IVMSP-L5.4: FAST BELIEF PROPAGATION PROCESS ELEMENT FOR HIGH-QUALITY STEREO ESTIMATION
         Chao-Chung Cheng; National Taiwan University
         Chia-Kai Liang; National Taiwan University
         Yen-Chieh Lai; National Taiwan University
         Homer Chen; National Taiwan University
         Liang-Gee Chen; National Taiwan University
 
IVMSP-L5.5: RECONSTRUCTION OF ISOMETRICALLY DEFORMABLE FLAT SURFACES IN 3D FROM MULTIPLE CAMERA IMAGES
         Ricardo Ferreira; Instituto Superior Técnico
         João Xavier; Instituto Superior Técnico
         João Costeira; Instituto Superior Técnico
 
IVMSP-L5.6: APPROXIMATING 3D SHAPE USING BEZIER SURFACE
         Mannan Saeed Muhammad; GIST
         Muhammad Tariq Mahamood; GIST
         Tae-Sun Choi; GIST
 

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